Semiconductor Services

Please Browse the list below to see the products we represent.
If you would like us to represent your product, please contact info@rgktechsales.com

LOCAL IC PACKAGING & Design
- BGA Substrates
- IC Package Design
- COB
- Wirebonding Stack Die
- Simulation
- RF Design
- Flipchip


SEMI TEST BOARDS
- DUT
- LOAD
- PROBE
- SOCKET
- Work with all tester footprints

 

LOCAL IC PACKAGING & ASSEMBLY
-
Wire Bonding
- Thick & Thin Film
- MIL-PRF-38534
- Flipchip
- Hybrid /MCM
- Optoelectronics
- Alumina
- BEO
- Aluminum Nitrate
- Hermertic Selling & Testing
- SMT Assembly on Package
- Solider Ball Placement
- Stud Bumping
- RF Ribbon Bonding




 

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